Wojiech Misiolek
Wojiech MisiolekMeeting challenges in materials processing

Wojciech Z. Misiolek, Loewy Professor and Chair of the Department of Materials Science and Engineering (MSE) and an expert in aluminum metal forming, received the 2020 William Hunt Eisenman Award from ASM International. The award honors “unusual achievements in industry in the practical application of materials science and engineering through production and engineering use” and is typically given to industry professionals. Misiolek is one of few specialists from academia to earn the recognition, which highlighted the “technology transfer of his engineering science knowledge to industrially relevant materials processing.”

Working with industry partners, Misiolek and his graduate students develop tools that address industrial challenges. His efforts in physical and numerical modeling of materials processing involve physical metallurgy and materials characterization and have applications in structural materials, biomaterials, and materials for energy. He also directs Lehigh’s Loewy Institute, which researches applications of metals with an emphasis on international collaboration.

Himanshu JainA lifetime of contributions to glass science research

Himanshu Jain, T.L. Diamond Distinguished Chair in Engineering and Applied Science and MSE professor, won the highly prestigious 2020 N.F. Mott Award, sponsored by the Journal of Non-Crystalline Solids (JNCS). It is granted once every two years to a senior scientist who has provided extensive and impactful contributions to glass science over the course of a career in research.

Jain has “contributed extensively to understanding the electrical properties of glasses, chalcogenide glasses, bioactive glasses, and laser-induced crystallization. He stands among the twenty most prolific researchers of the glass community and is also one of the five most active authors of the JNCS.”

Jain is a founding director of Lehigh’s Institute for Functional Materials and Devices (I-FMD), which pursues new materials and innovative devices that underpin grand challenges.